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NLSV1T34 1-Bit Dual-Supply Non-Inverting Level Translator
The NLSV1T34 is a 1-bit configurable dual-supply voltage level translator. The input An and output Bn ports are designed to track two different power supply rails, VCCA and VCCB respectively. Both supply rails are configurable from 0.9 V to 4.5 V allowing universal low-voltage translation from the input An to the output Bn port.
Features http://onsemi.com MARKING DIAGRAMS
UDFN6 MU SUFFIX CASE 517AA UDFN6 MU SUFFIX CASE 517AQ ULLGA6 MX1 SUFFIX CASE 613AF X M = Specific Device Code = Date Code SC-88A (SOT-353/SC-70) DF SUFFIX CASE 419A 5 W0 M G G M M G Q
* * * * * * *
*
Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V High-Speed w/ Balanced Propagation Delay Inputs and Outputs have OVT Protection to 4.5 V Non-preferential VCCA and VCCB Sequencing Power-Off Protection Power-Off High Impedance Inputs and Outputs Ultra-Small Packaging: 1.45 mm x 1.0 mm ULLGA6 2.0 mm x 2.1 mm SC-88A 1.2 mm x 1.0 mm UDFN6 1.45 mm x 1.0 mm UDFN6 These are Pb-Free Devices
5
1
AM
1
QM
1
Typical Applications
* Mobile Phones, PDAs, Other Portable Devices
Important Information
1
1
* ESD Protection for All Pins:
VCCA A
HBM (Human Body Model) > 3000 V
VCCB B
W0 = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.
PIN ASSIGNMENT
VCCA 1 A2 GND 3 6 VCCB VCCA 1 5 NC 4B A2 GND 3 4B 5 VCCB
Figure 1. Logic Diagram
ULLGA6/UDFN6 (Top View)
SC-88A (Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2010
April, 2010 - Rev. 5
1
Publication Order Number: NLSV1T34/D
NLSV1T34
PIN ASSIGNMENT
PIN VCCA VCCB GND A B FUNCTION Input Port DC Power Supply Output Port DC Power Supply Ground Input Port Output Port
TRUTH TABLE
INPUTS A L H OUTPUTS B L H
MAXIMUM RATINGS
Symbol VCCA, VCCB VI VO IIK IOK IO ICCA, ICCB IGND TSTG DC Supply Voltage DC Input Voltage DC Output Voltage (Power Down) (Active Mode) DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current per Ground Pin Storage Temperature A B B Rating Value -0.5 to +5.5 -0.5 to +5.5 -0.5 to +5.5 -0.5 to +5.5 -20 -50 50 100 100 -65 to +150 VI < GND VO < GND VCCA = VCCB = 0 Condition Unit V V V V mA mA mA mA mA C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol VCCA, VCCB VI VIO TA Dt / DV Positive DC Supply Voltage Bus Input Voltage Bus Output Voltage (Power Down Mode) (Active Mode) Operating Temperature Range Input Transition Rise or Rate VI, from 30% to 70% of VCC; VCC = 3.3 V 0.3 V B B Parameter Min 0.9 GND GND GND -40 0 Max 4.5 4.5 4.5 VCCB +85 10 Unit V V V V C nS
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NLSV1T34
DC ELECTRICAL CHARACTERISTICS
-405C to +855C Symbol VIH Parameter Input HIGH Voltage Test Conditions VCCA (V) 3.6 - 4.5 2.7 - 3.6 2.3 - 2.7 1.4 - 2.3 0.9 - 1.4 VIL Input LOW Voltage 3.6 - 4.5 2.7 - 3.6 2.3 - 2.7 1.4 - 2.3 0.9 - 1.4 VOH Output HIGH Voltage IOH = -100 mA; VI = VIH IOH = -0.5 mA; VI = VIH IOH = -2 mA; VI = VIH IOH = -6 mA; VI = VIH IOH = -12 mA; VI = VIH IOH = -18 mA; VI = VIH IOH = -24 mA; VI = VIH VOL Output LOW Voltage IOL = 100 mA; VI = VIL IOL = 0.5 mA; VI = VIH IOL = 2 mA; VI = VIH IOL = 6 mA; VI = VIL IOL = 12 mA; VI = VIL IOL = 18 mA; VI = VIL IOL = 24 mA; VI = VIL II ICCA ICCB Input Leakage Current Quiescent Supply Current Quiescent Supply Current VI = VCCA or GND VI = VCCA or GND; IO = 0, VCCA = VCCB VI = VCCA or GND; IO = 0, VCCA = VCCB VI = VCCA or GND; IO = 0, VCCA = VCCB VI = 4.5 V 0.9 - 4.5 0.9 1.4 1.65 2.3 2.3 2.7 2.3 3.0 3.0 0.9 - 4.5 1.1 1.4 1.65 2.3 2.7 2.3 3.0 3.0 0.9 - 4.5 0.9 - 4.5 0.9 - 4.5 0.9 - 4.5 0 0.9 - 4.5 0.9 1.4 1.65 2.3 2.3 2.7 2.3 3.0 3.0 0.9 - 4.5 1.1 1.4 1.65 2.3 2.7 2.3 3.0 3.0 0.9 - 4.5 0.9 - 4.5 0.9 - 4.5 0.9 - 4.5 0 0.9 - 4.5 VCCB (V) 0.9 - 4.5 Min 2.2 2.0 1.6 0.65 * VCCA 0.9 * VCCA - - - - - VCCB - 0.2 0.75 * VCCB 1.05 1.25 2.0 1.8 2.2 1.7 2.4 2.2 - - - - - - - - - -1.0 - - - - Max - - - - - 0.8 0.8 0.7 0.35 * VCCA 0.1 * VCCA - - - - - - - - - - 0.2 0.3 0.35 0.3 0.4 0.4 0.6 0.4 0.55 1.0 2.0 2.0 4.0 5.0 mA mA mA mA mA V V V Unit V
ICCA + ICCB Quiescent Supply Current IOFF Power OFF Leakage Current
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NLSV1T34
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB)
-405C to +855C VCCB (V) 4.5 VCCA (V) 4.5 3.3 2.8 1.8 0.9 Min Max 2 2 <2 <1 < 0.5 Min 3.3 Max 2 2 <1 <1 < 0.5 Min 2.8 Max 2 2 <1 < 0.5 < 0.5 Min 1.8 Max 2 2 < 0.5 < 0.5 < 0.5 Min 0.9 Max < 1.5 < 1.5 < 0.5 < 0.5 < 0.5 Unit A A A A A
NOTE: Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power-up sequence of VCCA and VCCB will not damage the IC.
AC ELECTRICAL CHARACTERISTICS
-405C to +855C VCCB (V) 4.5 Symbol tPLH, tPHL
(Note 1)
3.3 Max 1.6 1.7 1.9 2.1 2.4 Min Max 1.8 1.9 2.1 2.4 2.7 Min
2.8 Max 2.0 2.1 2.3 2.5 2.8 Min
1.8 Max 2.1 2.3 2.5 2.7 3.0 Min
1.2 Max 2.3 2.6 2.8 3.0 3.3 Unit nS
Parameter Propagation Delay, A to B
VCCA (V) 4.5 3.3 2.8 1.8 1.2
Min
1. Propagation delays defined per Figure 2.
CAPACITANCE
Symbol CI/O CPD Parameter I/O Pin Input Capacitance Power Dissipation Capacitance Test Conditions VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz Typ (Note 2) 5.0 5.0 Unit pF pF
2. Typical values are at TA = +25C. 3. CPD is defined as the value of the IC's equivalent capacitance from which the operating current can be calculated from: ICC(operating) ^ CPD x VCC x fIN where ICC = ICCA + ICCB.
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NLSV1T34
VCC
Pulse Generator
DUT CL RL
Figure 2. AC (Propagation Delay) Test Circuit
Test CL = 15 pF or equivalent (includes probe and jig capacitance) RL = 2 kW or equivalent ZOUT of pulse generator = 50 W VIH Vm tPLH Output (Bn) Vm Vm tPHL Vm VOL Waveform 1 - Propagation Delays tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 0V VOH Switch
Input (An)
Figure 3. AC (Propagation Delay) Test Circuit Waveforms
VCC Symbol VmA VmB 0.9 V - 4.5 V VCCA/2 VCCB/2
ORDERING INFORMATION
Device NLSV1T34MUTCG NLSV1T34AMUTCG NLSV1T34AMX1TCG NLSV1T34DFT2G Package UDFN6 (Pb-Free) UDFN6 (Pb-Free) ULLGA6 (Pb-Free) SC-88A (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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NLSV1T34
PACKAGE DIMENSIONS
SC-88A, SOT-353, SC-70 CASE 419A-02 ISSUE J
A G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
DIM A B C D G H J K N S
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025
0.40 0.0157 1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P CASE 517AA-01 ISSUE C
EDGE OF PACKAGE
D
A B L1
2X
0.10 C
2X
0.10 C
0.10 C
(A3) A
A1
10X
0.08 C
SIDE VIEW A1
5X 1 3
SEATING PLANE
C L
L2
6X
b 0.10 C A B 0.05 C
NOTE 3
6
4
e BOTTOM VIEW
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EEE EEE EEE
DETAIL B Side View (Optional) 0.40 PITCH
EE EE
PIN ONE REFERENCE
E
DETAIL A Bottom View (Optional)
EXPOSED Cu MOLD CMPD
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50
TOP VIEW
A3
MOUNTING FOOTPRINT*
0.42
6X
0.22
6X
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P CASE 517AQ-01 ISSUE O
D A B L1
PIN ONE REFERENCE
L
L
E
OPTIONAL CONSTRUCTIONS
DETAIL A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DIM A A1 A2 b D E e L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 --- 0.15
0.10 C
0.10 C
DETAIL B
0.05 C
6X
A A1 SIDE VIEW e
1 3
OPTIONAL CONSTRUCTIONS
0.05 C
A2
C
SEATING PLANE PACKAGE OUTLINE
6X
L
DETAIL A
6
4
6X
b 0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
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EE EE
EEE EEE EEE
TOP VIEW
EXPOSED Cu
MOLD CMPD
DETAIL B
MOUNTING FOOTPRINT
0.30
6X
1.24
0.53
6X
1
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NLSV1T34
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P CASE 613AF-01 ISSUE A
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40
PIN ONE REFERENCE
0.10 C
0.10 C 0.05 C
6X
0.05 C
L1 1
PKG OUTLINE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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EEEE EEEE EEEE
1 6
E
TOP VIEW
A SIDE VIEW A1 e
3 SEATING PLANE
MOUNTING FOOTPRINT SOLDERMASK DEFINED*
0.49
5X
C
0.30
6X
5X
L
NOTE 4
1.24
0.53
4 6X
b 0.10 C A B 0.05 C
NOTE 3
0.50 PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NLSV1T34/D

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